G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control components

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SEMI E117-1104 (Reapproved 0816)

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G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control componentsThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a